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X-ray inspection equipment(IGBT) - List of Manufacturers, Suppliers, Companies and Products

X-ray inspection equipment Product List

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X-ray imaging service

You can take images with the new X-ray device! Internal CT images of multilayer circuit boards and automatic inspection screens for IC wire bonds, etc.

We would like to introduce our "X-ray imaging service." We can extract only the soldering parts of module components and also perform IGBT inspections, allowing for the detection of hidden voids. The imaging models include FX-300tR2, FX-400tRX, FX-500tRX, IX-1610, and ILX-2000, and we can respond quickly for same-day imaging. 【Specifications】 ■ X-ray output: 90kV, 110kV, 130kV, 160kV ■ X-ray tube current: 60µA to 300µA ■ Geometric magnification: 20x to 2000x ■ Resolution: 0.25µm to 5µm ■ Sample size: up to 510×460mm *For more details, please download the PDF or feel free to contact us.

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3D X-ray observation device FX-300 tRX2/LL with CT

Support for large substrates up to 600×600mm is also possible! A compact sealed tube type X-ray device that achieves a geometric magnification of 1,000 times.

The "FX-300 tRX2/LL with CT" is a three-dimensional X-ray observation device that employs X-ray stereo technology. It is capable of canceling chip components mounted on the underside of BGA, LGA, QFN, etc. Additionally, a convenient chip counter function (capable of counting quantities in reel state) is now standard. 【Features】 ■ Adopts X-ray stereo technology (unique technology by Ibit) ■ Achieves a geometric magnification of 1,000 times ■ Equipped with a chip counter function ■ High-magnification oblique shooting possible with wide-angle X-ray irradiation ■ An LL model compatible with large substrates of 600×600mm is also available *For more details, please refer to the PDF document or feel free to contact us.

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3D X-ray observation device that supports X-ray inspection and chip component counting with one unit.

Equipped with a 1,000 times high-magnification X-ray inspection machine and a convenient chip counter as standard. It can count the quantity of electronic components in about 30 seconds.

The "FX-300 tRX2 with CT" is a three-dimensional X-ray observation device that can inspect the chip components on the underside of a circuit board by canceling them out using its unique "X-ray stereo method." It also comes standard with a chip counter function, allowing it to count the quantity of electronic components such as square chips, ICs, and LEDs in reel form in approximately 20 to 30 seconds. This product supports dual functions for "inspection of BGA, LGA, QFN, etc." and "counting the number of chip components" at a reasonable price. 【Features】 ■ Geometric magnification of 1,000 times ■ Compact sealed tube type ■ Capable of diagonal shooting at high magnification ■ The LL model supports large circuit boards of 600×600mm ■ Optional features such as automatic BGA inspection, vertical CT, and diagonal CT can also be added *For more details, please refer to the PDF document or feel free to contact us.

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3D X-ray observation device 'FX-300tRX2 with CT'

A compact sealed tube X-ray device that achieves a geometric magnification of 1,000 times! You can reduce inspection costs.

In conventional X-ray inspections, the chip components on the backside became noise components, making accurate inspections difficult. By using the "X-ray stereo method" developed by I-BIT, it has become possible to cancel out chip components mounted on the backside, such as BGA, LGA, and QFN. In this product, unlike conventional X-ray CT methods, it does not require tomographic images, allowing for high-speed processing. 【Features】 ■ Adoption of X-ray stereo method (our proprietary technology) ■ Achieved geometric magnification of 1,000 times ■ Equipped with chip counter function ■ High-magnification oblique shooting possible with wide-angle X-ray irradiation ■ Measurement of solder rise (solder filling rate) in through-holes is possible *New feature ■ Automatic BGA inspection function (optional) ■ VCT (Vertical CT) and PCT (Oblique CT) functions (optional) *For more details, please refer to the PDF document or feel free to contact us.

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Multifocus X-ray inspection device "Cheetah EVO"

【Exhibition at Nepcon (Booth No. 11-26)】Active in the manufacturing field of semiconductors and electronic components. Supports three mode switches and monochrome expression with 65,536 gradations.

The "Cheetah EVO" is a versatile X-ray inspection device that can be used for a wide range of applications in the production of semiconductors and electronic components. It allows switching between nano-focus, micro-focus, and high-power modes, making it easy to observe electronic components, resin parts, rubber parts, and metal parts, as well as analyze mounted circuit boards. It supports a field of view of 160×160mm and can output monochrome with 65,536 gradations. With its high versatility, it is widely utilized in manufacturing, quality assurance, and development departments, and is also active in semiconductor and electronic component factories, as well as contract analysis companies in the electronics industry. ★ It will be exhibited at "Internepcon Japan," starting on January 25, 2023. 【Features】 ■ High-speed and reproducible inspections are possible ■ Automatic calculation of voids using VoidInspect ■ User-friendly and powerful filters such as eHDR ■ Best laminography with micro3Dslice and FF CT software ■ Dose reduction kit, dose monitoring, and low-dose detector mode for high-sensitivity components ■ Option for a new water-cooled X-ray tube that achieves stable focal position ■ Option to select high load capacity (under 20kg)

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